Quebec tender · Avis d’appel d’offres
Wire-Bonding System /Système de soudure par fil
Reference number: C0005044
Issuing organization: Université McGill
Location: Montréal
Published: 2026-07-08
Closing date: 2026-07-30
Tender details
Université McGill has issued a tender in Montréal for a wire-bonding system. This is a lab equipment purchase, likely for precision semiconductor, materials, or research applications.